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 | GKG-G5 Fully automatic solder paste printing machine |
| It can perfectly meet the process requirements of fine pitch, high precision and high speed such as 01005 and 0.25pich. | |
| Screen frame size 370*370~737*737mm | |
| Substrate size 50*50/450*340mm | |
| Printing accuracy ±20Um@6,cpk≥2.0 | |
 | SITEK3D SPI |
| S8080 3D solder paste detector | |
| Multi-directional surround full coverage projection technology ensures optimal 3D detection capabilities. | |
| The world's leading patented technology enables each FOV to be completed in 0.3 seconds. | |
| 3D digitization can optimize the entire SMT process and achieve higher automation | |
| Complete IPC standard public library | |
 | Jintuo double track reflowJTE-800D |
| Heating time 30mins | |
| Temperature range Room temperature-300℃ | |
| PCB maximum width 270mm×2 | |
| Temperature control method PID closed loop control + SSR drive | |
| Temperature test line 4 | |
| Transport system Double guide rail + mesh belt transport | |
 | AOIAutomatic Optical Inspection |
| Camera 6 million CCD color industrial camera | |
| Image processing speed 01005 element <6 milliseconds, each drawing processing <100 milliseconds | |
| Light source RGB ring LED structure light source | |
| Detection content | |
| Solder paste printing, skew, insufficient tin, excessive tin, bridging tin, short circuit, component inspection, missing parts, skewed parts, sideways parts, flipped parts, reversed polarity, and damaged parts |
