Kilandu operates a turnkey PCBA factory in Shenzhen, China, providing end-to-end electronics manufacturing for industrial, automotive and medical customers. Services cover SMT assembly, through-hole DIP, box build and functional testing under a single IATF 16949 certified quality system.
SMT Assembly Lines
Placement runs on high-speed SMT lines with automated solder-paste printing, 3D SPI inspection and reflow profiling for stable, traceable output. The equipment list is set out on the Shenzhen factory page.
- GKG-G5 fully automatic solder-paste printer: fine-pitch capability down to 01005 and 0.25 mm pitch, print accuracy plus or minus 20 micrometres at 6 sigma (Cpk greater than or equal to 2.0).
- SITEK 3D SPI S8080 solder-paste inspector: 0.3 seconds per field of view, full IPC standard library.
- Jintuo double-track reflow oven JTE-800D: PID closed-loop control, four temperature test lines.
- Six-megapixel CCD AOI: inspects solder defects and missing, skewed or reversed components in under 6 milliseconds per device.
DIP and Through-hole Assembly
The DIP lines handle through-hole and mixed-technology boards, with wave soldering, selective soldering and hand-insertion workstations. Process detail is on the DIP assembly page.
Quality Management
All assemblies are RoHS and REACH compliant, and inspection data is retained for full traceability. The management-system certificates are listed on the quality assurance page.
Capacity and Lead Time
Lead time is confirmed with the quotation, and the drivers behind it are explained on the MOQ and lead time page. Kilandu supports both prototype and volume production for OEMs across Europe, Russia and the Americas.
Factory Evidence
Ten points a buyer or a third-party auditor can check on the production floor in Shenzhen. Each title links to the page that documents it in full.
Four Yamaha high-speed lines (YS24 + YS12) with automatic solder-paste printing and a Jintuo JTE-800D reflow oven, about 150 million placements per month.
Solder-paste volume is measured before placement on a SITEK 3D SPI S8080: 0.3 seconds per field of view against the full IPC standard library.
Six-megapixel CCD optical inspection runs after reflow and flags solder defects and missing, skewed or reversed components in under 6 milliseconds per device.
Joints that cannot be seen optically, such as BGA and QFN terminations, are verified by X-ray.
Three automatic DIP lines cover through-hole and mixed-technology boards with wave soldering, selective soldering and hand-insertion workstations.
Acrylic, polyurethane or silicone coating is applied to assembled and tested boards, with masking planned from the assembly drawing and coverage verified before shipment.
Electrical verification covers in-circuit test (ICT) and functional test (FCT) against the test specification agreed for the programme.
Components are received, inspected and stored with lot-level material traceability, so a finished board can be traced back to the component lots used.
Incoming, in-process (SPI + AOI + X-ray) and final inspection are carried out to IPC-A-610 Class 2 or Class 3 as agreed per product, under IATF 16949 certified quality management.
Customer audits of the production site can be arranged, and overseas customers have carried out on-site audits in Shenzhen.
What PCBA services does Kilandu provide?
Kilandu provides turnkey PCBA services including SMT assembly, through-hole DIP, box build, functional testing and in-house component sourcing for industrial, automotive and medical customers.
What certifications does the Kilandu PCBA factory hold?
The complete list, with certificate numbers and issuing bodies, is published on the quality assurance page. Day to day this site runs to an ISO 9001:2015 quality management system, with workmanship at IPC-A-610 Class 2 or Class 3 as agreed per product.
What is the monthly SMT capacity?
Four Yamaha high-speed SMT lines provide a combined capacity of about 150 million component placements per month.
What are the typical PCBA lead times?
Typical turnkey PCBA lead time is 2 to 5 weeks, depending on BOM complexity and component availability.