Customer requirement
A control and power-interface board for an audio device: typically 4 layers, ~300 components, pilot build. Clean power and ESD care lead.
Manufacturing challenge
- Audio analogue next to power switching raises crosstalk risk.
- Connector ESD at the user surface.
- FCT validates audio path and power interface.
Solution
Kilandu runs this board through a controlled NPI-to-production flow rather than a one-shot build:
- DFM: footprint, stack-up and test-point review is completed and fed back before any parts are ordered.
- Sourcing: turnkey procurement of the BOM, with qualified alternates managed for long-lead and obsolete parts.
- SMT: high-speed SMT lines with inline SPI, AOI and X-ray on BGA, voiding and hidden joints.
- Assembly: selective DIP for through-hole content and, where needed, conformal coating.
- Test: ICT for net integrity, then FCT for the board-specific functions above.
X-ray on BGA; FCT covered audio and power.
Result
First-article inspection to IPC-A-610 Class 2/3 is completed, a golden sample is retained as the release baseline, and a pilot run is signed off before mass production. Per-batch traceability (lot, AOI/X-ray records and ICT/FCT logs) is kept. Order quantities and the the customer specific acceptance result are confirmed per project.
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