This page has moved
Our content for this application is now consolidated on one page: IoT PCBA - wireless module and sensor board assembly.
Wi-Fi, BLE, LoRa, NB-IoT and cellular module placement, sensor boards, edge gateways and smart metering boards are covered there, including RF layout review, antenna-aware assembly, low-power validation and functional test.
If you came here from a bookmark, please update it. For a quotation on an IoT, sensor or gateway board, send the Gerber, BOM and pick-and-place files through the contact page.
Can you assemble boards that carry pre-certified wireless modules?
Yes. Modules are placed and soldered as part of the turnkey build together with the rest of the BOM, then the finished assembly goes through AOI and functional test on fixtures matched to your product.
How do you handle RF sections on a mixed board?
RF performance is largely fixed by layout, so it is raised at DFM review: keep-out around the antenna, ground plane continuity under the radio, separation between the RF and switching power sections, and impedance control on the feed line where the stack-up allows it. Where a pre-certified module is used, we assemble to the module manufacturer layout guidance rather than substituting equivalent routing.
Can you support low-power and battery products?
Yes. Low-power designs mostly fail on leakage and sleep current rather than on placement, so the review focuses on the power path, the selection and orientation of the regulator and its externals, and cleanliness around high-impedance nodes where flux residue could create leakage paths. Cleanliness is specified and controlled where the design is sensitive to it.
Do you support small-form-factor and high-density IoT boards?
IoT boards usually pack sensing, wireless and power management into a small area. We place the full BOM including fine-pitch parts, run AOI through SMT, and issue traceable inspection records per batch.