Game console motherboard PCB

Customer requirement

A game-console motherboard on high-Tg material: typically 6–8 layers, ~700 components, mass build. High layer count and HDI features dominate.

Manufacturing challenge

• HDI micro-vias and high layer count raise yield risk.
• High-speed SoC needs length-matched, impedance-controlled routing.
• High-volume FCT must cover SoC, memory and I/O quickly.

Solution

Kilandu runs this board through a controlled NPI-to-production flow rather than a one-shot build:

• DFM: footprint, stack-up and test-point review is completed and fed back before any parts are ordered.
• Sourcing: turnkey procurement of the BOM, with qualified alternates managed for long-lead and obsolete parts.
• SMT: high-speed SMT lines with inline SPI, AOI and X-ray on BGA, voiding and hidden joints.
• Assembly: selective DIP for through-hole content and, where needed, conformal coating.
• Test: ICT for net integrity, then FCT for the board-specific functions above.

X-ray on BGA/micro-via; FCT streamed high-speed functional test.

Result

First-article inspection to IPC-A-610 Class 2/3 is completed, a golden sample is retained as the release baseline, and a pilot run is signed off before mass production. Per-batch traceability (lot, AOI/X-ray records and ICT/FCT logs) is kept. Order quantities and the the customer specific acceptance result are confirmed per project.